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authorXiang Chen <chenxiang66@hisilicon.com>2018-12-17 22:40:07 +0800
committerMartin K. Petersen <martin.petersen@oracle.com>2018-12-18 23:35:02 -0500
commitd6a9000b81befd436fe4bcdae76322928bda724c (patch)
treedc4afdcc5d5d91bc02226f4e704105a37b9716dd /block
parent4e87eb2f46ea547d12a276b2e696ab934d16cfb6 (diff)
scsi: hisi_sas: Add support for DIF feature for v2 hw
For v3 hw, we support DIF operation for SAS, but not SATA. In addition, DIF CRC16 is supported. This patchset adds the SW support for the described features. The main components are as follows: - Get protection mask from module param - Fill PI fields - Fill related to DIF in DQ and protection iu memories Signed-off-by: Xiang Chen <chenxiang66@hisilicon.com> Signed-off-by: John Garry <john.garry@huawei.com> Signed-off-by: Martin K. Petersen <martin.petersen@oracle.com>
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